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(parent: 883d877) | patch
mtd: spinand: Add initial support for Winbond W25M02GV
authorFrieder Schrempf <frieder.schrempf@exceet.de>
Thu, 16 Aug 2018 15:30:14 +0000 (17:30 +0200)
committerJagan Teki <jagan@amarulasolutions.com>
Thu, 20 Sep 2018 14:40:49 +0000 (20:10 +0530)
commit3181c0a622d35bd8e6d4407458e7204d4df5a8c1
treea8e1455fb92826e84532b2b8544603b9f7c45427tree | snapshot
parent883d8778ae177172c0a53c018faa39e61f30dea3commit | diff
mtd: spinand: Add initial support for Winbond W25M02GV

Add support for the W25M02GV chip.

Signed-off-by: Frieder Schrempf <frieder.schrempf@exceet.de>
Signed-off-by: Boris Brezillon <boris.brezillon@bootlin.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Acked-by: Jagan Teki <jagan@openedev.com>
drivers/mtd/nand/spi/Makefile diff | blob | history
drivers/mtd/nand/spi/core.c diff | blob | history
drivers/mtd/nand/spi/winbond.c [new file with mode: 0644] blob
include/linux/mtd/spinand.h diff | blob | history
Broadcom-s U-Boot